LAI HENG TECHNOLOGY LTD.

1.0mm Pitch Single Row Wafer,180° SMT

1.0mm Pitch Single Row Wafer , 90° SMT

1.0mm Pitch Single Row Crimp Terminal Housing

1.0mm Pitch Wire-to-Board Terminal

1.0mm Pitch Dual Row Wafer, 180° SMT (CAP)

1.0mm Pitch Dual Row Wafer, 180° SMT, Gold Plated,CAP

1.0mm Pitch Dual Row Wafer, 180° SMT, Gold Plated,With Post

1.0mm Pitch Dual Row Wafer , 90° SMT

1.0mm Pitch Dual Row Wafer , 90° SMT,Gold Plated

1.0mm Pitch Dual Row Crimp Terminal Housing

1.25mm Pitch Single Row Wafer, 180° DIP

1.25mm Pitch Single Row Wafer ,90° DIP

1.25mm Pitch Single Row Wafer, 180° SMT

1.25mm Pitch Single Row Wafer , 90° SMT

1.25mm Pitch Single Row Crimp Terminal Housing

1.25mm Pitch Wire-to-Board Terminal

1.25mm Pitch Single Row Wafer, 180° DIP

1.25mm Pitch Single Row Wafer ,90° DIP

1.25mm Pitch Single Row Wafer, 180° SMT ,With Post

1.25mm Pitch Single Row Wafer , 90° SMT ,With Post

1.25mm Pitch Single Row Crimp Terminal Housing

1.25 mm Pitch Dual Row Wafer, 180° SMT , With Peg

1.0mm Pitch Dual Row Crimp Terminal Housing

1.25 mm Pitch Single Row Wafer, 90° SMT ,

1.25 mm Pitch Single Row Wafer, 90° SMT , With Post

1.25mm Pitch Single Row Crimp Terminal Housing

1.5mm Pitch Single Row Wafer, 180° DIP

1.5mm Pitch Single Row Wafer , 90° DIP

1.5mm Pitch Single Row Wafer, 180° SMT

1.5mm Pitch Single Row Wafer , 90° SMT